The SMD assembly department has been introduced into the company relatively recently. In some ways, bringing all the production in-house at a time of general delocalization could seem to be an anachronistic choice. However, this decision has turned out to be one of the keys to our success; in this way we can offer our customers a finished product in which the entire process, from concept to assembly, is under our control and management. Not depending on third parties means we can guarantee the quality of all the production processes, plan the production according to the needs of our customers, and cater for small-scale productions, prototyping and peaks in product demand without having to rely on others. With an assembly capacity of around 60,000 chips/hr we can meet demanding production requirements, and at the same time maintain extreme flexibility thanks to some assembly machines installed off-line. Two optical silk-screen printers, five pick&place handlers and one sixteen-zone reflow oven represent the department’s main equipment. We fit all latest generation components such as µBGA, Fine Pitch, 0402, and CSP.
There has been a marked reduction in the demand for the assembly of PTH components over time, with SMD components taking over. Obviously our designers tend to use them only where strictly necessary on account of mechanical issues or because there is no similar surface-mounted component. Our department is able though to assemble any PTH component, and perform manual reflow or automatic wave soldering. The workbenches – all strictly ESD – are equipped with Weller multifunction digital soldering stations. The laboratory is completed by a deionized water and detergent washing line, plus a conformal coating (or tropicalization) line. This process consists of coating electronic circuitry with a film of protective resin to protect the components installed on the board from atmospheric agents, dust or aggressive vapours. The process prevents oxidation and the growth of dendrites that could compromise the operation of the device over time.
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